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 |  | 8.9HFPbSolder Paste
Indium8.9HF is an air reflow, no-clean solder paste which offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. It is one of our lowest voiding pastes.
 Features
 Halogen-free per EN14582 test methodLow BGA, CSP, QFN voidingOne of our most stable pastesHigh transfer efficiency through small apertures (≤ 0.66AR)Eliminates hot and cold slumpHigh oxidation resistanceWets well to oxidized BGA and pad surfacesExcellent soldering performance under high temperature and long reflow processesClear, probe testable flux residueCompatible with SnPb alloys
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