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DEK Pro XF is cleaning technology designed specifically for the under-stencil cleaning application. Formulated to optimise cleaning performance its process benefits include reduced cleaning cycle times and using less cleaning solution.
Safer, cleaner and more environmentally friendly than solvent based cleaners, DEK Pro XF does not affect the thixotropic properties of printing materials – reducing the risk of print defects such as bridging and solder balling.
When used with DEK Understencil Cleaning Fabric and Understencil Chemistry, true process performance synergies can be achieved enabling significant cost, yield and productivity improvements.
Optimising cleaning performance means achieving the greatest productivity, yield and cost reduction benefits. A truly optimised system requires a balance between cleaning solution, cleaning fabric, cleaning cycle time and cleaning system.
By using the DEK Pro XF cleaning solution and DEK Understencil Cleaning fabric, the amount of required cleaning solution can be reduced significantly and cleaning cycle time increased.
The DEK Cyclone oscillating cleaning system also extends the process advantages of these special materials even further, achieving a truly cost-effective, high performance clean.