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 | PASTEOT-800900-600CLead Free Solder Paste
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
 Features
 Eliminates clogged apertures through advanced rheologyExcellent wettingHalogen-free per EN14582 test methodEliminates hot and cold slumpHigh oxidation resistanceExcellent soldering performance under high temperature and long reflow processes
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