Selected Items (0)

Google+ Share Button Facebook Share Button Twitter Share Button

Search


Show results in new page:



Contact Us
Product Lines
Current Inventory
Place Order
Request Quote
Browse Products
Online Tools
kem-tron logo
Electronic Manufacturing Distribution and Representation Since 1989
8.9HFA
8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -325+500 (T3), 84%, Metals, Solder Paste 25 Gram Syringe
Mfgr Part No: PASTEOT-801124
In Stock: 0 ea
Add to order/quote

Currently 0 in stock.
Similar Indium Corporation 8.9HFA products can be found here

PASTEOT-801124



Lead Free Solder Paste

Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Features
  • Eliminates clogged apertures through advanced rheology
  • Excellent wetting
  • Halogen-free per EN14582 test method
  • Eliminates hot and cold slump
  • High oxidation resistance
  • Excellent soldering performance under high temperature and long reflow processes