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No Clean Solder Paste
NC-SMQ®92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.
- Excellent wetting reflow in air
- Probe-testable residue
- Extended open time
- Consistent fine-pitch printing
- Strong initial tack strength and long-term stability
- High humidity resistance
- Halogen-free
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