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8.9HFA
8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -325+500 (T3), 84%, Metals, Solder Paste 25 Gram Syringe
Mfgr Part No: PASTEOT-801124
In Stock: 0 ea
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -325+500 (T3), 88.5%, Solder Paste 500 Gram Jar
Mfgr Part No: PASTEOT-800714-500J
In Stock: 0 ea
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88%, Solder Paste 500 Gram Jar (800693-500J)
Mfgr Part No: PASTEOT-800693-500J
In Stock: 1 ea
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88%, Solder Paste 600 Gram Cartridge (800693)
Mfgr Part No: PASTEOT-800693-600C
In Stock: 0 ea
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88.5%, Solder Paste 600 Gram Cartridge (800900)
Mfgr Part No: PASTEOT-800900-600C
In Stock: 0 ea
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8.9HFA



Lead Free Solder Paste

Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Features
  • Eliminates clogged apertures through advanced rheology
  • Excellent wetting
  • Halogen-free per EN14582 test method
  • Eliminates hot and cold slump
  • High oxidation resistance
  • Excellent soldering performance under high temperature and long reflow processes